← Back to Library

How asml got euv

This piece reframes the current geopolitical scramble for semiconductor dominance by revealing a startling truth: the world's most advanced chip-making technology was born from decades of American public investment, yet its commercial crown rests in the hands of a single Dutch firm. Brian Potter doesn't just recount the history of Extreme Ultraviolet (EUV) lithography; he dissects the specific failure of the US to translate its massive R&D dominance into manufacturing hegemony, offering a crucial case study for today's industrial policy debates.

The Long Shadow of Moore's Law

Potter anchors the narrative in the relentless pressure of Moore's Law, the observation that the number of transistors on a chip doubles roughly every two years. He explains that this trend has been sustained not by magic, but by the continuous evolution of lithography—the art of printing microscopic patterns on silicon. As Potter notes, "The steadily shrinking size of transistors — from around 10,000 nanometers in the early 1970s to around 20-60 nanometers today — has been made possible by developing lithography methods capable of patterning smaller and smaller features." This framing is essential because it grounds the abstract concept of "chips" in the physical reality of light and diffraction.

How asml got euv

The author effectively dismantles the idea that the path to smaller chips was a straight line. Instead, he details how researchers hit a wall known as diffraction, where light spreads out and blurs the image, making it impossible to distinguish tiny features. The industry spent decades trying to bypass this with electron-beam or X-ray lithography, both of which failed to scale for mass production. Potter highlights the irony that optical lithography kept surviving against all odds, a phenomenon he captures with Sturtevant's Law: "the end of optical lithography is 6 – 7 years away. Always has been, always will be." This historical context is vital; it reminds us that the current dominance of optical methods was not inevitable, but the result of a brutal, decades-long survival of the fittest among competing technologies.

The Dawn of EUV and the American Engine

The core of Potter's argument lies in the transition from "soft X-rays" to EUV, a shift driven by a specific technical breakthrough: the multilayer mirror. Since no material can focus X-rays like a glass lens focuses visible light, researchers had to invent a way to reflect them. Potter writes, "By constructing a special mirror from alternating layers of different materials, known as a 'multilayer mirror', light near the X-ray region of the spectrum can be reflected at much steeper angles." This was the key that unlocked the 13.5-nanometer wavelength required for modern chips.

What makes this section so compelling is Potter's insistence on the American origin of this breakthrough. Despite the technology now being synonymous with ASML, the foundational work was a US-led effort involving DARPA, Bell Labs, IBM, and the National Laboratories. He recounts how researchers at Lawrence Livermore National Lab and Stanford were the ones who proved the concept, even as they faced ridicule. "You can't imagine the negative reception I got at that presentation," Potter quotes one researcher recalling the skepticism they faced in 1988. "Everybody in the audience was about to skewer me. I went home with my tail between my legs…"

You can't imagine the negative reception I got at that presentation. Everybody in the audience was about to skewer me. I went home with my tail between my legs.

This anecdote is powerful because it humanizes the high-stakes nature of industrial research. It underscores that the path to the future was paved with failure and doubt, not just linear progress. Potter's analysis suggests that the US government and private sector were willing to absorb the risk of failure, funding the "billion dollars" IBM invested in X-ray lithography and the synchrotrons required for early experiments. Critics might argue that the US simply lacked the commercial vision to spin this into a product, but Potter's evidence suggests a more complex reality: the technology was so complex and the timeline so long that no single US firm could justify the capital expenditure without a coordinated, state-backed effort that eventually fractured.

The Commercialization Gap

The article's most provocative point is the disconnect between the US doing the science and the Netherlands building the machine. Potter explains that while the US provided the "hundreds of millions of dollars" and the intellectual property, the commercialization required a level of integration that only a specialized, non-US entity could achieve. He details the immense engineering challenges, such as creating a light source powerful enough to turn tin into plasma without destroying the delicate mirrors. "Turning material into a plasma generated debris which reduced the life of the extremely sensitive multilayer mirrors," Potter writes, noting that "a great deal of effort [was] put into designing and testing a variety of debris minimization schemes."

The shift in nomenclature from "soft X-ray" to "Extreme Ultraviolet" in 1993 is a small but telling detail Potter includes to show how the industry rebranded to distance itself from the failures of the past. He notes that the name change was strategic, creating "associations with 'Deep Ultraviolet'" to signal a continuation of the successful optical lineage rather than a radical departure. This reframing was crucial for securing continued investment. However, the ultimate outcome remains a paradox: the US government and its national labs spent decades de-risking the technology, only to see the commercial winner emerge from a European consortium. Potter implies that the US failed to maintain the institutional continuity required to bridge the gap between a lab prototype and a factory-ready tool.

Bottom Line

Brian Potter's analysis is a masterclass in separating the myth of inevitable American technological supremacy from the messy reality of industrial policy. The strongest part of his argument is the detailed reconstruction of the multilayer mirror breakthrough, which proves that the US was the undisputed leader in the science of EUV. His biggest vulnerability, however, is the lack of a definitive answer on why the US failed to commercialize it; while he hints at the difficulty of coordinating such a massive effort, the specific policy failures that allowed ASML to seize the crown remain an open question for today's lawmakers. Readers should watch how the current CHIPS Act attempts to correct this historical imbalance, ensuring that the next breakthrough in physics doesn't end up being manufactured on the other side of the Atlantic.

Deep Dives

Explore these related deep dives:

Sources

How asml got euv

I am pleased to cross-post this piece with Factory Settings, the new Substack from IFP. Factory Settings will feature essays from the inaugural CHIPS team about why CHIPS succeeded, where it stumbled, and its lessons for state capacity and industrial policy. You can subscribe here.

Moore’s Law, the observation that the number of transistors on an integrated circuit tends to double every two years, has progressed in large part thanks to advances in lithography: techniques for creating microscopic patterns on silicon wafers. The steadily shrinking size of transistors — from around 10,000 nanometers in the early 1970s to around 20-60 nanometers today — has been made possible by developing lithography methods capable of patterning smaller and smaller features.1 The most recent advance in lithography is the adoption of Extreme Ultraviolet (EUV) lithography, which uses light at a wavelength of 13.5 nanometers to create patterns on chips.

EUV lithography machines are famously made by just a single firm, ASML in the Netherlands, and determining who has access to the machines has become a major geopolitical concern. However, though they’re built by ASML, much of the research that made the machines possible was done in the US. Some of the most storied names in US research and development — DARPA, Bell Labs, IBM Research, Intel, the US National Laboratories — spent decades of research and hundreds of millions of dollars to make EUV possible.

So why, after all that effort by the US, did EUV end up being commercialized by a single firm in the Netherlands?

How semiconductor lithography works.

Briefly, semiconductor lithography works by selectively projecting light onto a silicon wafer using a mask. When light shines through the mask (or reflects off the mask in EUV), the patterns on that mask are projected onto the silicon wafer, which is covered with a chemical called photoresist. When the light strikes the photoresist, it either hardens or softens the photoresist (depending on the type). The wafer is then washed, removing any softened photoresist and leaving behind hardened photoresist in the pattern that needs to be applied. The wafer will then be exposed to a corrosive chemical, typically plasma, removing material from the wafer in the places where the photoresist has been washed away. The remaining hardened photoresist is then removed, leaving only an etched pattern in the silicon wafer. The silicon wafer will then be coated with another layer of material, and ...